Magnetrons – A sputtering magnetron is a magnetic device that is used to enhance the sputtering process (thin film deposition). Its magnetic field is used to produce “flux tunnels” which trap electrons and locally increase current density. This higher volumetric density of trapped electrons results in greater localized ionization rates, which, consequently, produces “order of magnitude” improvements in sputter deposition rates.
Inherently, these localized enhancements result in systemic inhomogenieties that manifest themselves as localized wear patterns in targets (material acting as the coating) and variations in thin film characteristics over the surface of the substrate (component receiving the coating). Consequently, the shape, distribution, and characteristics of the magnetic field produced by the sputtering magnetron are pivotal to the success of the sputtering process; not only in the lab, but in production settings as well.
Magnetrons
MPCO in manipulating/enhancing magnetic field profiles results in magnetron designs focused on rectifying the shortcomings of OEM system. A sputtering magnetron’s field characteristics can be tuned to:
1. Improve Target Utilization
a. Longer Production Runs
b. Reduces Raw Material Consumption
2. Improve Thin Film Uniformity
a. Enhanced Product Functionality
3. Improve Deposition Rates
a. Higher Thru Put
In some instances, all three enhancements can be incorporated into a single magnetron design.
We have exhausted considerable efforts in developing designs for sputtering magnetrons. By incorporating strategically placed/oriented magnetic components into conventional designs (no physical changes in size), magnetrons can be designed to sputter targets up to twice as thick as their OEM counterparts while maintaining/enhancing their performance characteristics. Additionally, this technology allows for the sputtering of highly permeable magnetic targets, such as nickel or iron. This may negate the need for full cathode or system upgrades.
Types
• In general, there are four types of sputtering magnetron configurations used in the market (there are other less utilized configurations which can also be utilized and optimized, if required).
• Sweeping Planar
• Rotating Planar
• Rotatable
• Static Planar
Sweeping Planar
These rectangular magnetrons are typically designed with a side-to-side sweeping motion which is exploited to enhance target utilization. Sweeping can occur in any direction or combination of directions, but is usually limited to side-to-side. Target utilization for this type of magnetron is superior to that of static planar units, but can still be limited by “cross corner” or “turn around” trenching. Magnetic flux tunnel shaping can be incorporated to minimize or eliminate these production hindering features.
Sputter Through Thicker Targets
• Sputter Through Magnetic Targets
• Increase Deposition Rates
• Lower Operating Voltages/Power
Rotating Planar
These disk shaped magnetrons are typically designed with rotary motion which is exploited to enhance target utilization. Motion can occur axially as well, but is usually limited to strictly rotation. Target utilization for this type of magnetron is superior to that of static planar units, but can still be limited by trenching. Magnetic flux tunnel shaping can be incorporated to eliminate severe trenching while enhancing deposition rates and maintaining/improving uniformity.This technology can also be integrated to:
• Sputter Through Thicker Targets
• Sputter Through Magnetic Targets
• Increase Deposition Rates
• Lower Operating Voltages/Power
Rotatable
These sputtering magnetrons provide the greatest target utilization of all the configurations, but require cylindrically shaped targets. Due to the availability of materials in this form factor, some sputtering applications cannot integrate this technology.
Like the sweeping or rotating planar magnetrons, this configuration is also prone to “trenching” at the turn arounds which limits utilization. Flux tunnel shaping of the turn around sections as well as other dynamic modifications can be incorporated to enhance performance.
This technology can also be integrated to:
• Sputter Through Thicker Targets
• Sputter Through Magnetic Targets
• Increase Deposition Rates
• Lower Operating Voltages/Power
Static Planar
These sputtering magnetrons are utilized without motion. The simplest configurations to integrate, these units can be shaped to any form, but are typically provided in a rectangular or disk shape. Target utilization for this type of magnetron is poor but can typically be enhanced by magnetic flux profile shaping. In addition,
This technology can also be integrated to:
• Sputter Through Thicker Targets
• Sputter Through Magnetic Targets
• Increase Deposition Rates
• Lower Operating Voltages/Power
